Inline Vacuum-Reflow-Soldering Systems

Highlights Vacuum

• Optimized transport transfer - increasing process stability
• Heavy-duty transport with optimized profile coating - up to 10 kg/m in the vacuum system
• Products with a length of 100 mm possible
• Easy access for maintenance
• Cycle evacuation possible for complex components
• Profiles can be set with and without vacuum
• Continuous center support (tab link chain)

The vacuum soldering process and its advantages

• Pores are reduced by up to 99% - optimized solder joint quality
• 2 and 3 lane transport possible
• reliable transport handovers in the facility
• Suitable for printed circuit boards, DCBs, lead frames and workpiece carriers
• powerful vacuum pump (300 m³/h) fast and reliable vacuum process
• Parameters can be set individually: evacuation time, vacuum holding time, ventilation time, vacuum pressure

Setup of a vacuum soldering system

• Vacuum module between peak and cooling zone
• Stainless steel vacuum chamber
• Inline system
• Nitrogen capable
• Vacuum and non-vacuum process possible
• All vacuum parameters individually adjustable

System Models

The vacuum systems can be individually configured. You can choose between different lengths for the heating zone, the vacuum module and the cooling zone. Choice between one, two or three track versions..

• V350
• V450
• V580